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UNIST develops a new solution process to reduce the manufacturing cost of large-area OLED components

UNIST develops a new solution process to reduce the manufacturing cost of large-area OLED components
UNIST develops a new solution process to reduce the manufacturing cost of large-area OLED devices
The Ulsan Institute of Science and Technology (UNIST) in South Korea has developed original technology that can reduce the production cost of large-area OLED and other electronic components for the production of large-size TVs.

According to a report by Korean media Heraldbiz, the team of Professor Kim Bongsu of the Department of Natural Sciences of Ulsan Institute of Science and Technology (UNIST), the team of Professor Jo Jeongho of Yonsei University, and the team of Professor Kang Munseung of Sogang University jointly stated that through the "electric solution process" method that uses only solution processes Successfully produced transistors and logic circuits. The key is to develop a new "bridge agent" to prevent material damage in the original solution process.

Professor Kim Bongsu (left) of the Department of Chemistry, Ulsan Institute of Science and Technology is watching the experiment

The solution process is a method of dispersing the materials that make up electronic components into a solvent, and then making the electronic components in the same way as printed by an inkjet printer. Although cheaper than using expensive vacuum equipment, the disadvantage is that during the solution process, the material used to make the component may be damaged. Generally, electronic components are made by stacking different materials layer by layer. With the solution process, the materials may be damaged during the stacking process, and the materials may be deteriorated due to the high heat that occurs when the solvent is removed. Therefore, it is difficult to make complete components using only the solution process.

The research team developed a bridging agent that protects the various materials that make up the component while using a solution process to solve existing problems. The bridging agent acts as a bridge, supporting the material of the electronic components and grasping it firmly. Therefore, the component materials will be gathered together and can be supported by the heat or mechanical damage generated in the lamination process.

The research team used the developed bridging agent to make transistors with a special liquid process, and also made a logic circuit and measured performance. The experimental results show that the inherent electrical characteristics of electronic materials are well maintained, and the logic circuits are also operating normally.

Professor Kim Bongsu emphasized: "The newly developed bridging agent not only retains the characteristics of electronic materials, but also makes the special liquid process possible." "More importantly, the special liquid process has opened a breakthrough in the production of electronic components."

The results of this study were published in the online edition of the international academic journal "Nature Communications" on March 23.